Assembly and Packaging Production Lines for IGBT Power Modules, PCBs, etc.:
Vacuum Potting Technology:
Utilizes three-stage vacuum potting machines to achieve bubble-free encapsulation with silicone gel. Supports in-line weighing, flow monitoring, and data traceability to meet automotive-grade module requirements.
Fully Automated Production Line Integration:
Covers processes including frame adhesive curing, DBC sorting, vacuum reflow soldering, and lid assembly. Compatible with multiple module types such as HPD/Easy/Eco.
Precision Dispensing and Curing:
Provides equipment for precise mixing, dispensing, and curing of two-component adhesives. Applied in semiconductor chip packaging and sensor dispensing (e.g., ceramic capacitors/MEMS chips).
