IGBT Potting and Curing Production Line

The product flows from the previous process to this production line;

High temperature furnace solidification;

Cooling furnace quickly reduces product temperature;

Automatic cleaning and dust removal;

Vacuum glue filling (solves the problem of bubbles in the glue, allowing the glue to be filled uniformly, with a flat surface and complete internal filling);

High temperature furnace curing (accelerating adhesive curing);

Cooling furnace (quickly reducing product temperature);

Product flow to the next stage of the process;