Vacuum Pump Glue Supply

Our Vacuum Pressure Plate Pump is a dedicated barrel feeding equipment engineered for continuous delivery of high-viscosity adhesives, thermal conductive gap fillers, sealants and two-component potting compounds directly from standard raw material drums. Three mature standard models are available to match different production throughput demands: SP210, SP260 and SP280.

This drum-type follower plate feeding unit realizes bubble-free material transfer via vacuum-assisted feeding design, effectively eliminating air entrapment during glue supply and supporting nearly full emptying of barrel raw materials to reduce material waste. For non-standard custom-sized pails or containers incompatible with standard follower plates, the feeding system can be optionally fitted with conventional rubber pressure plates to expand application compatibility.

As a core module of the self-leveling adhesive supply system, this vacuum plate pump seamlessly connects with precision dispensing valves (screw dispensing valves, gear metering valves, plunger dispensing valves), dynamic mixing dispensing heads and in-line vacuum potting machines. Cooperating with multi-layer curing ovens, it forms a complete bubble-free feeding workflow for automated dispensing production lines.

It is widely applied for new energy manufacturing scenarios including flat wire motor stator dripping coating, PCB encapsulation, ECU & BMS potting, power semiconductor encapsulation, FIPG formed-in-place sealing, cylindrical cell gap potting and battery pack thermal conductive potting, ensuring stable, consistent raw material supply for mass production of automotive electronics and power devices.

• Liquid level display and alarm;

• Automatic alarm when empty loading;

• Vacuum pressure plate;

• Reciprocating pump, screw pump, double, screw pump, dual plunger pump;